Tongxing Intelligence Completes Series A+ Financing of Over 100 Million RMB

TOSUN Completes A+ Round of Over 100 Million Yuan Financing, Led by SDIC

In October 2023, Shanghai TOSUN Technology Ltd. successfully completed over 100 million yuan A+ round of financing. This round of financing was led by the second phase of Advanced Manufacturing Industry Investment Fund managed by China Investment Merchants, and followed by the old shareholders of Fengnian Capital over investment.

This round of financing will be used for product development and globalized market expansion.

About TOSUN

TOSUN has been focusing on the research and development of automotive electronics basic tool chain products, and is also a leading brand in this field. TOSUN'sCore software TSMaster and supporting hardware devices with embedded code generation, automotive bus analysis, simulation, testing and diagnostics, calibrationIt covers the whole process of R&D, testing, production, experimentation and after-sales service for automobile OEMs and components. There are more than 5,000 corporate users worldwide, covering: automotive OEMs, parts suppliers, chip makers, equipment/service providers, engineering machinery, aerospace and other fields. Headquartered in the National University Science Park of Tongji University in Jiading District, Shanghai, the company also has branches in Guangzhou, Beijing, Changchun, Chengdu, Taiwan and Stuttgart.
Tongxing Automotive Bus Hardware Tool TSMaster

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