Speaker Preview|TOSUN meets you at ICVS 2023 Annual Conference on Automated Driving in China

On December 21-22, 2023, the 3rd Annual ICVS China Autonomous Driving Conference 2023 will kick off at the Sheraton Jiading Hotel in Shanghai, China.December 22, p.m.With the domestic automotive electronics toolchain software TSMaster, TOSUN will participate in the special conference "Automotive Software Driving Technological Innovation" and deliver a speech.The topic of the presentation is "Joint Simulation Techniques to Enable Cost-Effective Software Development Testing".We look forward to your visit!

This exhibition is a year-end feast for 75+ guests, 100+ exhibitors, and 2000+ listeners to gather in automatic driving. 75+ big names in automatic driving industry from famous enterprises and colleges and universities will focus on hot topics in automatic driving industry, such as chip, radar, chassis, software, vehicle-circuit-cloud integration, and cabin-driving fusion, and will analyze cutting-edge policies, latest technologies, and development trends of the industry in depth.

Exhibit information

Time: December 21-22

Venue: Sheraton Shanghai Jiading Hotel

Booth: Booth 37

Presentation Topics

D2 Session I: "Automotive Software Driving Technology Innovation

Presentation: December 22nd 14:00-14:30

Venue: Sheraton Jiading Hotel, Shanghai

Speaker: CMO of TOSUN / Luo Weiguang

Sharing Topic: "Joint Simulation Technology to Realize Low-cost Software Development Testing".

About TOSUN

TOSUN has been focusing on the research and development of automotive electronics basic tool chain products, and is also a leading brand in this field. TOSUN'sCore software TSMaster and supporting hardware devices with embedded code generation, automotive bus analysis, simulation, testing and diagnostics, calibrationIt covers the whole process of R&D, testing, production, experimentation and after-sales service for automobile OEMs and components. There are more than 5,000 corporate users worldwide, covering: automotive OEMs, parts suppliers, chip makers, equipment/service providers, engineering machinery, aerospace and other fields. Headquartered in the National University Science Park of Tongji University in Jiading District, Shanghai, the company also has branches in Guangzhou, Beijing, Changchun, Chengdu, Taiwan and Stuttgart.